Topic Description Faculty Involved
MEMS Technology Optoelectronics, RF, biomedical, sensors Baginski, Ellis, Jaeger, Roppel, Wentworth,
Silicon-Germanium Devices and Technology Bandgap-engineered RF technology for wireless systems Niu,
Silicon-Carbide Devices and Technology High temperature and high power electronics Bozack, Dong, Niu, Tin, Williams,
RF Devices and Circuits for Wireless Systems Fundamentals of noise, linearity, circuit design issues Dai, Jaeger, Niu, Wentworth,
Monolithic Stress Sensors IC packaging diagnostics, reliability Ellis, Jaeger, Suhling,
SOI CMOS Devices and Technology Extreme environment electronics (e.g. space) Jaeger, Niu,
Multi-chip Modules and Packaging Reliability of modules and packages, package prototypes, new materials Bozack, Johnson, Knight, Suhling,
RF-Immune Electro-explosive Detonators Air bags, munitions Baginski,
Acoustic Wave Resonator for Biological Sensors Food safety detection, sensors Cernosek, Ellis, Neely, Wentworth,
Polycrystalline Diamond Films Diamond coatings, new deposition and etching methods Tzeng,
Fault Tolerant Systems for VLSI Systems Design for testability, system-on-a-chip Nelson, Singh,
Solder Fatigue in IC Packaging IC packaging reliability, modeling Johnson, Knight, Suhling,
High Heat Flux Cooling Novel cooling methods for high power density IC packages Bhavnani,
Carbon Nanotubes Displays, molecular electronics Dong, Mills, Tzeng,
Organic Semiconductors Flexible electronics, novel materials Mills, Thakur,
Extreme Environment Electronics High-T, low-T, radiation for space electronics Jaeger, Johnson, Niu, Williams,
Compound Semiconductor Growth New growth techniques, novel materials Bozack, Tin, Tzeng,
Metal-Semiconductor Contacts Understanding of metal-semiconductor contacts, new materials Bozack, Tin, Williams,
Physical Analysis of Novel Materials RBS, TEM, SEM, Auger, XPS, etc for materials analysis Bozack, Tzeng, Williams,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Bogdan M. Wilamowski
Director, Alabama Microelectronics Science and Technology Center
Auburn University